Kenaf-reinforced bioplastic strengthens cellphone handsets

30 March 2006

Japanese companies NEC and Unitika have commercialized kenaf fibre-reinforced bioplastic for the NTT DoCo FOMO N701IECO cellphone handset that is manufactured by NEC.

According to NEC and Unitika, the kenaf fibre-reinforced bioplastic has high impact resistance when dropped and is highly mouldable – these are both necessary features for handset cases. NEC first adopted the environmentally-friendly material for personal computers in late 2004.

The companies explain that kenaf fibre helps reinforce polylactic acid, largely improving the heat resistance of the plastic. The companies say that they have added a specific formula of vegetable softening agents and fillers for further reinforcement. The bioplastic contains around 90% vegetable-derived materials. The companies state that the material has achieved the highest level of performance attained by an electronic device bioplastic.

NEC and Unitika add that they will continue to develop kenaf-reinforced bioplastic for electronic device applications.